100% COMPATIBLE OR MONEYBACK GUARANTEE* COMPLETE RANGE SK HYNIX MEMORY MODULE - READY STOCK!!

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1 Oktober 2022
SK Hynix Shows Off 48GB and 96GB DDR5-6400 Memory Modules
SK Hynix demonstrates high-speed memory modules based on 24Gb DDR5 ICs. detail

23 November 2021
SK hynix Announces Development of HBM3 DRAM
Seoul, October 20, 2021 SK hynix Inc. (or “the Company”, www.skhynix.com) announced that it has become the first in the industry to successfully develop the High Bandwidth Memory 3, the world’s best-performing DRAM. detail

9 Desember 2020
SK hynix Launches World’s First DDR5 DRAM
SK hynix Inc. (or ‘the Company,’ www.skhynix.com) announced to launch world’s first DDR5 DRAM. It is a high-speed and high-density product optimized for Big Data, Artificial Intelligence (AI), and machine learning (ML) as a next generation standard of DRAM. detail

19 November 2018
SK Hynix Ready to Mass-produce DRAMs through Second-Generation 10nm Process By Kim Eun-jin
SK Hynix announced on Nov. 12 that the company has developed an 8Gbit DDR DRAM with higher productivity and power efficiency by applying a second-generation 10-nanometer micro-process. The company said the new technology boosted its productivity by about 20% while reducing 8Gbit DDR DRAMs’ consumption of electric power by more than 15%. This product can stably transfer data at a rate of 3,200Mbps, which is the highest rate supported by DDR4 standards. detail

16 November 2018
SK Hynix Reveals DDR4-3200 Memory Phase Clocking
SK Hynix this week announced that it has completed development of its latest-generation DDR4 memory chips. The new DRAM chips are made using the company’s second-generation 10 nm-class fabrication technology (1Ynm) and feature a number of enhancements designed to cut-down die sizes, reduce power consumption, and improve their frequency potential. detail

15 November 2018
SK hynix develops next-gen DRAM DDR5 for big data, AI applications
South Korea’s second-largest chipmaker SK hynix said Thursday that it has developed next-generation dynamic random-access memory, 16 gigabits DDR5, which offers speed and improved power efficiency to meet demand from sectors with intensive computing needs, such as big data analytics and artificial intelligence. detail

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OVERVIEW

Overview

DRAM Solutions for your PCs and Servers

For a wide range of requirements, our DRAM Module solutions satisfy

whatever need you have for your PCs and Servers.
Leading to the right solution for a faster and more reliable experience.

UDIMM

UDIMM

Full Name
Unbuffered DIMM
Features
  • Without a buffer or register → faster latency
  • Low density modules only (Due to error issues)
  • Supports 2DPC and up to 2 ranks per DIMM
Main Application
Desktop

SODIMM

SODIMM

Full Name
Small Outline DIMM
Features
  • Smaller than normal DIMMs
  • For systems with limited space issues
Main Application
Notebook

RDIMM

RDIMM

Full Name
Registered DIMM
Features
  • A register is placed between system memory controller and DRAM to control DIMM’s address and command signals
  • Added 8 bit parity signals for error correction
  • Supports x8, x4 DRAM / Supports 3DPC and up to 4 ranks per DIMM
Main Application
Server

LRDIMM

LRDIMM

Full Name
Load-Reduced DIMM
Features
  • Register replaced with memory buffer to reduce load
  • Better latency and better fit for high density modules
Main Application
Server

ECC UDIMM / ECC SODIMM

ECC UDIMM / ECC SODIMM

Full Name
Error Correction Code UDIMM / SODIMM
Features
  • Able to detect and correct data corruption
  • Reduces number of crashes
Main Application
Server

VLP RDIMM / VLP ECC UDIMM

VLP RDIMM / VLP ECC UDIMM

Full Name
Very Low Profile RDIMM / ECC UDIMM
Features
  • Height lower than normal DIMMs
  • Takes less space, better cooling, but not fit for high density modules
Main Application
Server (Blade)